Electronic semiconductor products (chips, wafers, PCB boards, semiconductor packages, etc.) have strict requirements for the insulation of coatings, the sealing property of adhesives, and the traceability of identification. High-precision detection and marking are needed to ensure performance.
Coating Inspection: Through the SC900 series intelligent coating inspection equipment, the thickness uniformity of the passivation coating (such as SiO₂ coating) on the wafer surface is inspected to identify defects such as pinholes and cracks, preventing circuit short circuits caused by coating failure. The SC600 series is utilized to detect the moisture-proof coating of the chip packaging shell in real time, ensuring the stable operation of semiconductor devices in a humid environment.
Glue detection: The S350-DD23 glue line detection equipment can detect the conductive glue/insulating glue between the chip and the substrate on the PCB board, accurately identify problems such as broken glue and abnormal glue volume, and prevent poor contact of the chip. The S350-DS23 series online AOI system can detect the path of the encapsulation adhesive at the lead bonding points of semiconductor packaging, ensuring the sealing performance of the packaging and preventing the intrusion of water vapor and impurities.
Laser marking: The S350-SX laser marking machine marks batch numbers and traceability codes on the edges of wafers and the surfaces of chips, achieving full-process traceability of semiconductor products from production to application and meeting the industry's strict requirements for quality control.
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